Thin Film Processing

Cambridge Microfab Ltd
Broadway, Bourn
Cambridge CB23 2TA
England

T: +44 (0) 1954 718100
F: +44 (0) 1954 718164
E: info@microfab.co.uk

Thin Film Processing

We have been depositing and patterning high quality single and multilayer thin films in a wide range of materials on a variety of substrates for over 20 years using custom UHV deposition and etching equipment designed & built in-house.

Materials Deposition

neutral stress films of:
conductors
semiconductors
dielectrics
single crystal films
polycrystalline films
sputter systems with vacuum load locks
UHV conditions can be maintained for months
Our UHV systems routinely achieve base pressures of 10 ^-10 torr

Temperature Control

temperature control is important to facilitate phase & morphology control
stable closed loop heating control
open loop Peltier refrigeration to -25⁰C
liquid nitrogen refrigeration to -170⁰C

Chemical & Plasma Etching

we routinely prepare & pattern a range of materials:
Al, Hf, Mo, Nb, Re, Ta, Ti, V, W
image left: part processed Ta-Al structure patterned by plasma & acid etching
pixel pitch nom 35 µm
wire width nom 2.5 µm

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Cambridge Microfab Limited

Thin Film Processing

Materials Deposition

Temperature Control

Chemical & Plasma Etching